IEI can promise you longer product life by components guarantee and RoHS compliance now!
Power Consumption Real-Time Running Test
WAFER-9371A Power Consumption
(+5V) 10minutes in 25
Test Sample
Unit
Ampere
2.02
A
Test Configuration
CPU Type
Celeron400MHz
RAM Module
Transcend PC133 256M
Install OS: Windows 2000
3D Mark 2001
VGA Type
S3-VIA Twister
DirectX
9.0b
Resolution
800 X 600
Color Pixel
32
VGA Memory
8M
Score
365
Thermal Testing !
Infrared thermography is a latest development equipment, which detects infrared energy emitted from object, converts it to temperature, and displays image of temperature distribution.
Brand
NIPPON
Model Neo
Thermo TVS-700
Testing Result !
IEI WAFER-9371A
A-Brand 9371
Fact 1
Thermal Test
Peak Value
Max. Temp
Min. Temp
WAFER-9371A
66.7°C
52.5°C
9371
76.8°C
57.3°C
WAFER-9371A temp range : 14.2°C 9371 temp range : 19.5°C
IEI WAFER-9371A operates with minimum difference in surface temperatures on separate sections of the board. A better temperature control guarantees a more reliable system operation in the long run.
Fact 2
Thermal Test
Heatsink Area
CPU Temp
NB Temp
SB Temp
Heatsink Average Temp
WAFER-9371A
56.4°C
56.3°C
55.5°C
56.06°C
9371
57.4°C
57.3°C
56.3°C
57.0°C
Based on the same CPU, NB, and SB components, the WAFER-9371A presents the better thermal transfer through the heatsink, therefore is ideal for fanless applications.
Fact 3
Thermal Test
Board Area 1 and 2
Area 1
Area 2
P4
P6
P7
P8
P5
P9
WAFER-9371A
66.7°C
52.5°C
56.8°C
NA
60.0°C
58.9°C
9371
75.3°C
57.4°C
58.3°C
60.4°C
76.8°C
64.1°C
Proven by the numbers deducted from the same area comparison in multiple hot spots, the WAFER-9371A is thermally superior and more apt for embedded systems.
Fact 4
IEI WAFER-9371A
A-Brand 9371
A new heatsink tops three major heat-emitting chips and effectively dissipates heat. Helped by a new layout, once again the WAFER-9371A is proved to be a cooler choice.
Cool and Quiet
All New Heat-Sink design
Good aerodynamics
The IEI Heatsink was designed in a way that air can easily and quickly float through the cooler, and reach all cooling fins. Especially it having a very large amount of fine fins.
Perfect flatness of the contact area by IEI new close flatness technology !!!
The part of the heatsink that is in contact with the heat source must be perfectly flat. A flat contact area allows you to use a thinner layer of thermal compound, which will reduce the thermal resistance between heatsink and heat source.
Good mounting method
For good thermal transfer, the pressure between heatsink and heat source must be high. IEI Heatsink clips was designed to provide a strong pressure, while still being reasonably easy to install.
Good thermal transfer within the heatsink
Large cooling fins are pointless if the heat can't reach them, so the IEI heatsink was designed to allow good thermal transfer from the heat source to the fins.
Complete and Easy LCD Support
One 36 bit TFT, 18-bit or 24-bit LCD panel, with up to 1024 x 768 resolution supported
2 channel LVDS interface supported
Diskless Booting
IEI BIOS PXE feature supports Boot-on-LAN with ATX power supply
PXE: Pre-Boot Execution Environment
PXE is an open industry standard developed by a number of software and hardware vendors. IEI BIOS PXE Feature allows a workstation to boot from a server on a network prior to booting the operating system on the local hard drive. In order to boot on LAN, it requires setting up the PXE server, too.
RoHS Compliance
IEI is committed to compliance with all applicable laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) in electrical and electronic products. IEI's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.
Performance Test
System Configuration
BIOS: WAFER-9371A V 1.0
Memory: 512MB SO-DIMM X 1
VGA Card: VIA 8606 (Onboard VGA) Resolution 1024x768 ,32 bit Color
RoHS ready now!
Good aerodynamics
