威强发布高性能坚固型嵌入式计算机TANK-820-H61

[ Date: 2013-3-6 17:7]

特征

高性能

扩展卡极大的灵活性

•	通过底板提供 2 PCI + 1 PCIe (2P1E) 或 1 PCI + 2 PCIe (1P2E) 解决方案

坚固的嵌入式计算机

•	支持 -20~60°C (w/ SSD, air flow)

扩展槽支持附加卡

附加卡:	应用:
采集卡 / 显卡 / 运动控制卡等..	自动化 / 监控/ 交通等..

高度集成 I/O 接口

规格

型号	TANK-820-H61
尺寸 (WxDxH)	133 x 269 x 206 mm
系统风扇	60 x 60 mm
机箱材质	挤压铝合金型材
CPU	2nd Generation Intel® • Core i5 Dual Core 2xxT (Above 2.7GHz) • Core i3 Dual Core 2xxT (Above 2.5GHz) • Pentium Dual Core G6xxT (Above 2.2GHz)
芯片组	Intel® H61
系统内存	板载 DDR3 2GB 内存 1 x 204-pin DDR3 SDRAM SO-DIMM (SO-DIMM: Max 8GB)
硬盘驱动	1 x 2.5" SATA HDD Bay
CF 卡	1 x CF Type II
USB 3.0	2
USB 2.0	4
Ethernet	2 x RJ-45 Realtek 8111E GbE LAN 支持 ASF 2.0
RS-232	4 x DB-9 2 x DB-9 w/isolation
RS-422/485	2 x RJ-45
数字 I/O	8 bit 数字 I/O, 4 bit 输入 / 4 bit 输出
显示	1 x VGA 1 x DVI-I
音频	1 x 音频输出; 1 x 麦克风输入
PCI	2P1E: 2 x PCI 1P2E: 1 x PCI
PCIe	2P1E: One PCIe x 8 (physical PCIe x 16 slot) 1P2E: One PCIe x 1 (physical x 4 slot); One PCIe x 8 (physical x 16 slot)
电源输入	冗余双直流电源输入接线板: 9~24V 直流电源插孔: 9~24V
安装方式	Desktop, Wall mount
操作温度	-20°C ~ 60°C with air flow (SSD), 5% ~ 95%, 无冷凝
重量 (净重/毛重)	4.2Kg/6.3Kg

尺寸 (单位: mm)

包装清单

名称	料号	数量	描述
Utility CD		1
One Key Recovery CD	7B000-000724-RS	1
Power Adapter	63000-FSP120AAB-RS	1	FSP120-AAB, 90 ~ 264V input, 120W, 19VDC output (for TANK-820)
Power Cord	32702-000401-100-RS	1	1500 mm, European Standard
Mounting Bracket	41020-0366E4-00-RS	2	Wall mount bracket, Mount bracket, NCT processing formation, TANK-820 RoHS
Mounting Bracket Screws	44033-040062-RS	4
HDD Screw	44043-030051-RS	4	M030*05 for securing HDD
Rubber Foot Pad Screws	44033-040061-RS	4	M4*6 for securing rubber foot pads (for TANK-820)
RJ-45 to DB-9 COM Port Cable	32005-000200-200-RS	2	Round cable, RS-232/422/485, RS-232 cable, 2, 300mm, 26AWG, (A) D-SUB 9P male, (B) RJ-45 8P8C+SHELL, RoHS
Pluggable DC-in Terminal Block	33502-000007-RS	1	3-pin terminal block
Foot Pads	46007-001500-RS	4	BOTTOM PAD, NF-002, 11.5D8.7D7.4H, black rubber, RoHS
FAN screws	44003-030151-RS	4	For TANK-820

订购信息

料号		描述
TANK-820-H61-i5/2G/2P1E-R10		Extend temperature embedded system with One PCIe x 8 and two PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
TANK-820-H61-i5/2G/1P2E-R10		Extend temperature embedded system with One PCIe x 1 and one PCIe x 8 and one PCI expansion, Core i5 Dual Core 2xxT CPU (Above 2.7GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
TANK-820-H61-i3/2G/2P1E-R10		Extend temperature embedded system with One PCIe x 8 and two PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
TANK-820-H61-i3/2G/1P2E-R10		Extend temperature embedded system with One PCIe x 1 and one PCIe x 8 and one PCI expansion, Core i3 Dual Core 2xxT CPU (Above 2.5GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
TANK-820-H61-P/2G/2P1E-R10		Extend temperature embedded system with One PCIe x 8 and two PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
TANK-820-H61-P/2G/1P2E-R10		Extend temperature embedded system with One PCIe x 1 and one PCIe x 8 and one PCI expansion, Pentium Dual Core G6xxT CPU (Above 2.2GHz), TDP 35W, Dual 9-24V DC-IN, 2GB DDR3 Memory on-board, -20°C~60°C, R10
Memory Selection	DDR3-SO-1333-2GB	SO-DIMM DDR3 1333 MHz 2GB
	DDR3-SO-1333-4GB	SO-DIMM DDR3 1333 MHz 4GB